■ Move-Free Supporter E-Chuck
(Electrostatic Chuck)
● No ESD
● Workable in Vacuum Environments
● Be able to adsorb Metal / Semiconductor / Glass / Paper / Porous materials
(Electrostatic Chuck)
● No ESD
● Workable in Vacuum Environments
● Be able to adsorb Metal / Semiconductor / Glass / Paper / Porous materials
Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents.
Developed by advanced technology to enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier. After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel.
Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.
Developed by advanced technology to enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier. After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel.
Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.
■ (Move-Free) Wafer Supporter
1. Developed by special technology to enclose electrical field in the E-Chuck.
2. Need connect controller for about 30 seconds to switch the adhesion state.
3. After adhesion setting, Cordless Move-Free Supporter can move freely even disconnecting the power supply.
4. Maximum operating temperature: 250 degrees centigrade.
5. Suitable for soft, thin and fragile object carriers. (Eg, thin wafer, thin glass panel, 4"wafer-on-6"chuck Shape Reinforcement Carrier, Wafer Transfer).
1. Developed by special technology to enclose electrical field in the E-Chuck.
2. Need connect controller for about 30 seconds to switch the adhesion state.
3. After adhesion setting, Cordless Move-Free Supporter can move freely even disconnecting the power supply.
4. Maximum operating temperature: 250 degrees centigrade.
5. Suitable for soft, thin and fragile object carriers. (Eg, thin wafer, thin glass panel, 4"wafer-on-6"chuck Shape Reinforcement Carrier, Wafer Transfer).
■ Other Products
① (Move-Free) Wafer Supporter
② (Wired) Robot Hand Holder
③ (Cordless) Battery Power Holder
④ Foil Holder
⑤ 2D Curved Holder
⑥ 3D Curved Holder
⑦ Palm Holder
⑧ Vacuum AOI Holder
⑨ Huge Stitching Holder
⑩ Other Custom Holders
② (Wired) Robot Hand Holder
③ (Cordless) Battery Power Holder
④ Foil Holder
⑤ 2D Curved Holder
⑥ 3D Curved Holder
⑦ Palm Holder
⑧ Vacuum AOI Holder
⑨ Huge Stitching Holder
⑩ Other Custom Holders
■ Demonstration Video
Move-Free Wafer Supporter Carrier
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Move-Free Supporter Carrier AutoLoad
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100um Thin Wafer Handling
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Contact E-mail : [email protected]
Phone : +886 (0)-3-5824192, +886 (0)-915-669-072 (LINE, WhatsApp), WeChat: edragon168
Copyright 2014 of EDRAGON TECHNOLOGY CORPORATION
Phone : +886 (0)-3-5824192, +886 (0)-915-669-072 (LINE, WhatsApp), WeChat: edragon168
Copyright 2014 of EDRAGON TECHNOLOGY CORPORATION