■ Patent Coulomb-Force E-Chuck (Electrostatic Chuck)
● No ESD
● Workable in Vacuum Environments
● Be able to adsorb Metal / Semiconductor / Glass / Paper / Porous materials
● No ESD
● Workable in Vacuum Environments
● Be able to adsorb Metal / Semiconductor / Glass / Paper / Porous materials
Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents.
Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel.
Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.
■ Main Handling Applications
(1) Big-Size Flat Film and Panel
(2) Big-Size Warp Wafer Transfer and Moving
(3) Semiconductor BGBM Thin Wafer
(4) Thin Warp Wafer
(5) Move-Free Shape Reinforcement
(6) Cupper Foil
(7) Soft Film
(8) Curved Glass
(9) Vacuum Lamination in OLED, Touch Panel
(10) Vacuum deposition
Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel.
Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.
■ Main Handling Applications
(1) Big-Size Flat Film and Panel
(2) Big-Size Warp Wafer Transfer and Moving
(3) Semiconductor BGBM Thin Wafer
(4) Thin Warp Wafer
(5) Move-Free Shape Reinforcement
(6) Cupper Foil
(7) Soft Film
(8) Curved Glass
(9) Vacuum Lamination in OLED, Touch Panel
(10) Vacuum deposition
■ Adhere Various Materials
(1) Metal conductor (e.g., copper foil)
(2) Semiconductors (e.g., silicon, GaAs)
(3) Insulators (e.g., paper, glass panel)
(4) Porous objects.
(5) The adsorption force per unit area is related to the adsorption material and the contact surface smoothness.
(6) Material ranking of the adsorption force per unit area is : Metal > Semiconductors > Insulator.
■ Operational Environments
(1) Atmospheric Pressure.
(2) Vacuum Environment.
(1) Metal conductor (e.g., copper foil)
(2) Semiconductors (e.g., silicon, GaAs)
(3) Insulators (e.g., paper, glass panel)
(4) Porous objects.
(5) The adsorption force per unit area is related to the adsorption material and the contact surface smoothness.
(6) Material ranking of the adsorption force per unit area is : Metal > Semiconductors > Insulator.
■ Operational Environments
(1) Atmospheric Pressure.
(2) Vacuum Environment.
■ Product Features
(1) Coulomb-Force Electrostatic Chuck.
(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.
(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode
(4) Apply lowest voltage to keep maximum adhesion force.
(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.
(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.
(7) Work normally in a vacuum environments and general atmospheric environments.
(8) Can define adhesion area and non-adhesion area. Non-adhesion area can define other functions.
(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass.
(10) Can be customized into various sizes and thicknesses for customer's applications.
(11) Advanced technology enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier.
(12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.
(1) Coulomb-Force Electrostatic Chuck.
(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.
(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode
(4) Apply lowest voltage to keep maximum adhesion force.
(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.
(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.
(7) Work normally in a vacuum environments and general atmospheric environments.
(8) Can define adhesion area and non-adhesion area. Non-adhesion area can define other functions.
(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass.
(10) Can be customized into various sizes and thicknesses for customer's applications.
(11) Advanced technology enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier.
(12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.
■ Comparisons with other products
■ Product Portfolio
■ Main Products
① (Move-Free) Thin Warpage Wafer Supporter
1. General Power Input 110V/220V
2. Be able to keep adhesion without power source connection and Move Freely.
3. Need put on controller platform for about 30 seconds to switch the adhesion state.
4. After adhesion setting, even disconnecting power, supporter can move freely and keep adhesion status.
5. Maximum operating temperature: 200 degrees centigrade.
6. Suitable for soft, thin and fragile object carriers. (Eg, thin wafer, thin glass panel, 4"wafer-on-6"chuck Shape Carrier).
② (Wired) Robot Hand Holder
1. General Power Input 12V
2. Real time power switch by controller to set adsorption or release.
3. Maximum operating temperature: 200 degrees centigrade (E-Chuck surface).
4. Suitable for automation equipments. (Eg, curved glass, borderless screen, OLED vacuum Lamination.)
③ (Cordless) Battery Power Holder
1. Battery power
2. Could be charged by general power
3. Easily to move and handle objects
4. Be able to be vehicles between manufacturing machines
■ Custom Products
④ Palm Holder
⑤ Anti-wrinkle Foil Holder
⑥ 2D Curved Holder
⑦ 3D Curved Holder
⑧ AOI Holder (Black)
⑨ Huge Stitching Holder
⑩ Other Custom E-Chucks
■ Main Products
① (Move-Free) Thin Warpage Wafer Supporter
1. General Power Input 110V/220V
2. Be able to keep adhesion without power source connection and Move Freely.
3. Need put on controller platform for about 30 seconds to switch the adhesion state.
4. After adhesion setting, even disconnecting power, supporter can move freely and keep adhesion status.
5. Maximum operating temperature: 200 degrees centigrade.
6. Suitable for soft, thin and fragile object carriers. (Eg, thin wafer, thin glass panel, 4"wafer-on-6"chuck Shape Carrier).
② (Wired) Robot Hand Holder
1. General Power Input 12V
2. Real time power switch by controller to set adsorption or release.
3. Maximum operating temperature: 200 degrees centigrade (E-Chuck surface).
4. Suitable for automation equipments. (Eg, curved glass, borderless screen, OLED vacuum Lamination.)
③ (Cordless) Battery Power Holder
1. Battery power
2. Could be charged by general power
3. Easily to move and handle objects
4. Be able to be vehicles between manufacturing machines
■ Custom Products
④ Palm Holder
⑤ Anti-wrinkle Foil Holder
⑥ 2D Curved Holder
⑦ 3D Curved Holder
⑧ AOI Holder (Black)
⑨ Huge Stitching Holder
⑩ Other Custom E-Chucks
■ Demonstration Video
Adhere Various Materials
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(Wired) Robot Hand Holder
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(Move-Free) Wafer Supporter Carrier
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(Cordless) Palm Holder
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Foil Holder
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(Cordless) Palm Holder : 100um Thin Wafer Handling
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(Move-Free) E-Chuck Supporter Carrier Auto Mount
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■ Related Articles
Contact E-mail : [email protected]
Phone : +886 (0)-3-5824192, +886 (0)-915-669-072 (LINE, WhatsApp), WeChat: edragon168
Copyright 2014 of EDRAGON TECHNOLOGY CORPORATION
Phone : +886 (0)-3-5824192, +886 (0)-915-669-072 (LINE, WhatsApp), WeChat: edragon168
Copyright 2014 of EDRAGON TECHNOLOGY CORPORATION